ADATA XPG V3 DDR3 Overclocking DRAM Module applies Thermal Conductive Technology (TCT) with unique detachable fins for the ultimate cooling performance and stability when the system is in full-speed operation. It's designed as the best solution for gamers and enthusiasts thanks to high stability, compatibility, and durability.

XPG V3 DDR3 DRAM Module utilizes the Thermal Conductive Technology (TCT), which makes every chip have contact with the heat sinks directly, ensuring IC and PCB operate in an environment of equal temperature; therefore, XPG V3 is able to maintain the best stability, even in full-speed operation. The unique detachable fins extend the heat sinks upwards for more cooling space and generate improved cooling performance. And the 8-layer PCB with 2oz copper helps to reduce the electric resistance effectively and consume less power, which greatly enhances the integrity of signal transfer.